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Power chips are attached to external circuits via product packaging, and their efficiency relies on the assistance of the product packaging. In high-power situations, power chips are usually packaged as power components. Chip affiliation refers to the electric connection on the upper surface area of the chip, which is usually light weight aluminum bonding cable in standard components. ^
Conventional power module plan cross-section

Today, business silicon carbide power components still mostly make use of the packaging innovation of this wire-bonded typical silicon IGBT component. They deal with problems such as large high-frequency parasitical parameters, insufficient warm dissipation ability, low-temperature resistance, and insufficient insulation strength, which restrict using silicon carbide semiconductors. The screen of outstanding efficiency. In order to address these problems and fully manipulate the big prospective advantages of silicon carbide chips, lots of brand-new product packaging modern technologies and solutions for silicon carbide power modules have emerged in recent times.

Silicon carbide power module bonding approach

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have created from gold cable bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually established from gold cords to copper cables, and the driving pressure is cost decrease; high-power gadgets have established from light weight aluminum cables (strips) to Cu Clips, and the driving force is to boost item performance. The higher the power, the higher the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that uses a strong copper bridge soldered to solder to link chips and pins. Compared with conventional bonding product packaging approaches, Cu Clip innovation has the complying with benefits:

1. The connection between the chip and the pins is made from copper sheets, which, to a particular level, changes the standard cable bonding technique between the chip and the pins. For that reason, a distinct bundle resistance value, greater current flow, and better thermal conductivity can be gotten.

2. The lead pin welding area does not need to be silver-plated, which can fully save the price of silver plating and inadequate silver plating.

3. The item appearance is entirely consistent with normal items and is mainly made use of in web servers, mobile computers, batteries/drives, graphics cards, electric motors, power supplies, and other fields.

Cu Clip has two bonding techniques.

All copper sheet bonding approach

Both eviction pad and the Resource pad are clip-based. This bonding method is a lot more costly and complicated, yet it can accomplish far better Rdson and better thermal results.

( copper strip)

Copper sheet plus cable bonding approach

The source pad makes use of a Clip approach, and the Gate makes use of a Cable technique. This bonding approach is somewhat more affordable than the all-copper bonding method, conserving wafer location (applicable to very little gateway areas). The process is simpler than the all-copper bonding approach and can acquire much better Rdson and far better thermal effect.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding stranded copper wire, please feel free to contact us and send an inquiry.

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